| PART |
Description |
Maker |
| B72580T0600S172 B72580T0950S172 B72580T6750K072 B7 |
Multilayer technology MLV; Telecom Series 多层技术反转录电信系列
|
EPCOS AG
|
| MLVS-0402 MLVS0402L08 MLVS0402M04 MLVS0402M07 MLVS |
This specification is applicable to Chip Metal Oxide Varistor in multilayer technology.
|
List of Unclassifed Manufacturers
ETC
|
| PIC18LF4685T-I_SP PIC18F2682 PIC18F2682-I_ML PIC18 |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
| SIGC07T60SNC |
IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient
|
Infineon Technologies AG
|
| SIGC14T60SNC |
IGBT Chip in NPT-technology 600V NPT technology 100渭m chip short circuit prove
|
Infineon Technologies AG
|
| Q67040S4722 Q67040S4724 IGP30N60T IGW30N60T |
1200V IGBT for frequencies up to 10kHz for hard switching applications and up to 30kHz for soft switching. Combined Trench- and Fieldstop-Technology. ...
LOW LOSS IGBT IN TRENCH AND FILEDSTOP TECHNOLOGY
|
INFINEON[Infineon Technologies AG]
|
| FT231XS-X FT231XQ-X DSFT231X FT231XQ-T FT231XS-R |
Future Technology Devices International Ltd FT231X
Single chip USB to asynchronous serial data transfer interface
Future Technology Devices International Ltd.
|
List of Unclassifed Manufacturers
Future Technology Devices I...
Future Technology Devic...
|
| 2222207556 2238207556 2255207555 2250207555 222220 |
General Purpose & High Capacitance
SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS
SURFACE-MOUNT CERAMICV MULTILAYER CAPACITORS
This specification describes X7R series chip capacitors with lead-free terminations
SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS
SURFACE-MOUNT CERAMICV MULTILAYER CAPACITORS
|
YAGEO Corporation
List of Unclassifed Manufac...
|
| NMC0805Y5V105Z6.3TRP3KF NMC0603Y5V105Z6.3TRP3KF NM |
Multilayer Ceramic Chip Capacitors CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 1 uF, SURFACE MOUNT, 0805
Multilayer Ceramic Chip Capacitors 多层陶瓷芯片电容
Multilayer Ceramic Chip Capacitors CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 1 uF, SURFACE MOUNT, 1206
|
NIC Components Corp.
NIC Components, Corp.
|
| 05006-BP1R2CDU-R 05006-BP1R5CDU-R 05006-BP1R8ADU-R |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000012 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000015 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000018 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000001 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000022 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000005 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000082 uF, SURFACE MOUNT, 0805 CHIP, HALOGEN FREE AND ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000082 uF, SURFACE MOUNT, 0805 CHIP, HALOGEN FREE AND ROHS COMPLIANT
|
Vishay Intertechnology, Inc.
|
| SIGC03T60SNC |
IGBT Chip in NPT-technology 600V NPT technology 100μm chip
|
Infineon Technologies AG
|
|
